The Dual Cool™ package is a top-side cooling PQFN device that incorporates new packaging technology which enables additional power dissipation through the top of the package resulting in more than 60 ...
To meet the needs for high current capability, high efficiency and smaller form factors, Fairchild Semiconductor developed the Dual Cool(tm) packaging for MOSFETs. The Dual Cool package is a top-side ...
CONCORD TOWNSHIP, Ohio & VENLO, Netherlands--(BUSINESS WIRE)--Ranpak Holdings Corp. (“Ranpak”) (NYSE: PACK), a global leader of environmentally sustainable, paper-based packaging solutions for ...
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