Cadence and Samsung Foundry Deepen 2nm and 3D‑IC Collaboration to Meet Surging AI Infrastructure and Physical AI Demand

Cadence (Nasdaq: CDNS) and Samsung Foundry today announced development of a full portfolio of Memory and Interface IP, and expanded certification of Cadence’s agentic AI digital, custom, 3D‑IC and ...
Nasdaq

Ansys Enables 3D Multiphysics Visualization of Next-Generation 3D-IC Designs with NVIDIA Omniverse

PITTSBURGH, June 19, 2024 /PRNewswire/ -- Ansys (NASDAQ: ANSS) today announced that it is adopting NVIDIA Omniverse application programming interfaces (APIs) to offer 3D-IC designers valuable insights ...
Nasdaq

Alpha and Omega Semiconductor Supports 800 VDC Power Architecture for Next-Generation AI Factories with Innovative SiC and GaN, Power MOSFET, and Power IC Solutions

The shift from traditional 54V power distribution to an 800 VDC system is a fundamental change in data center design, aimed at overcoming the physical limits of existing infrastructure. By reducing ...

UMC Announces Release of 14nm eHV FinFET Platform, Advancing Innovation in Next-Generation Smartphone Displays

United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ("UMC"), a leading global semiconductor foundry, today announced the release of its 14nm embedded high-voltage (eHV) FinFET technology ...
MarketWatch

Movellus Partners with Synopsys to Deliver Power Efficiency for Next Generation IC's

The MarketWatch News Department was not involved in the creation of this content. SANTA CLARA, Calif., March 10, 2026 (GLOBE NEWSWIRE) -- Movellus announced the inclusion of its clocking technology in ...