The quantitative analysis of dislocation-type defects in irradiated materials is critical to materials characterization in the nuclear energy industry. The conventional approach of an instrument ...
Modern three-dimensional nanofabrication methods make it possible to generate arbitrarily shaped nanomagnets, including periodic networks of interconnected magnetic nanowires. Structurally similar to ...
Two-dimensional (2D) materials show great promise for photocatalysis, a key technology for sustainable energy solutions like water splitting. However, optimizing their performance requires precise ...
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AI-based model measures atomic defects in materials
In biology, defects are generally bad. But in materials science, defects can be intentionally tuned to give materials useful new properties. Today, atomic-scale defects are carefully introduced during ...
The third type of magnetism could prove the most useful of all—if researchers can identify the materials that exhibit it.
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AI model accelerates defect-based material design
Across the physical world, many intricate structures form via symmetry breaking. When a system with inherent symmetry transitions into an ordered state, it can form stable imperfections known as ...
The term molybdenum disulfide may sound familiar to some car drivers and mechanics. No wonder: the substance, discovered by U.S. chemist Alfred Sonntag in the 1940s, is still used today as a ...
Advancements in nanotechnology fabrication and characterization tools have facilitated a number of developments in the creation of new two-dimensional (2D) materials and gaining and understanding of ...
When we talk about defects, we generally think of flaws or impairments. However, as far as materials science is concerned, defects represent windows of opportunity. A new Collaborative Research Center ...
SEMVision™ H20 enables better and faster analysis of nanoscale defects in leading-edge chips Second-generation “cold field emission” technology provides high-resolution imaging AI image recognition ...
Variation is becoming a bigger problem in multi-die assemblies with TSVs and hybrid bonding. Multi-modal approaches are required to test these devices. AI plays a role in improving defect capture rate ...
Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...
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