SEMI Reports Global Semiconductor Equipment Billings Reached $135 Billion in 2025, Up 15% Year-on-Year

In 2025, the global front-end semiconductor equipment market posted solid growth, with wafer processing equipment sales ...
Florida Today

SiC Wafer Processing Market Expansion Accelerates, Projected to Reach US$ 2,986.44 Million by 2032

The global SiC Wafer Processing market size is projected to reach US$ 2,986.44 million by 2032, at a CAGR of 14.43% during 2026–2032. PUNE, MAHARASHTRA, INDIA ...

Intel Is On the Verge of Delivering Its First Billion-Dollar Foundry Wins

Advanced packaging has quietly become the make-or-break factor in the AI race. Hyperscalers need to combine chiplets, ...
Semiconductor Engineering

Back-End Automation Tackles Growing Complexity

Experts at the table: Semiconductor Engineering sat down to discuss back-end automation challenges in advanced packaging with Michael Lowman, senior product marketing manager for Data Analytics at ...
Silicon Semiconductor

CEA-Leti and Fraunhofer IPMS validate wafer exchange for ferroelectric memory materials

CEA-Leti and Fraunhofer IPMS have successfully completed the first exchange of ferroelectric memory wafers within the FAMES Pilot Line, marking a pivotal milestone in establishing a shared European ...
Hosted on MSN

Japanese chipmaker Rapidus begins test production of 2nm circuits — company commits to single-wafer processing ahead of 2027 mass production target

Rapidus on Friday announced that it had begun prototyping of test wafers with 2nm gate-all-around (GAA) transistor structures at its IIM-1 facility in Japan. The company confirmed that early test ...