Battery energy storage systems will play a key role in energy management as demand for sustainable and reliable energy ...

Broadcom’s 102.4-Tbits/s Ethernet switch chip, with options for 100G and 200G SerDes, targets scale-up and scale-out AI ...

Innovations in AI, AIoT, edge computing, and sensor fusion are driving the next generation of advances in smart cities and ...

Hirose introduces the FH79 Series back-flip FPC connector with a 40% reduction in width, targeting automotive and other harsh ...

Infineon introduces rad-hard GaN transistors, including one of the first DLA JANs-certified GaN devices, for space applications.

Integra Optics’ 800G transceivers address the growing demands of AI, cloud computing, and data center networks.

Mixed Signal Devices’ new timing portfolio delivers sub-20 fs jitter, 2-GHz performance, and rugged thermal stability.

STMicroelectronics claims first IMU with dual MEMS accelerometer and embedded AI with impact detection up to 320 g.

KOA Speer’s WN73H metal thin-film chip resistors deliver power ratings of 0.3 W in a 0306 package and 1 W in a 0612.

Bourns’ SRP2512CL and SRP3212CL power inductors deliver reduced losses and high efficiency to meet DDR5 memory specifications ...

NXP’s NTAG X DNA connected NFC tag, compatible with any NFC mobile device, combines high-density memory and a high data rate.

Circuit protection manufacturers boost performance and deliver smaller footprints for applications ranging from vehicles to ...