One of the standout features of the VIA Mobile-ITX is its power efficiency. The platform uses just 5 watts of power, making it an excellent choice for energy-conscious applications. This low power ...

Manufacturability issues' prevent Via's supersmall Mobile ITX motherboard from being used in UMPCs and other portable devices this year Via Technologies is not likely to ship its supersmall Mobile ...

The VIA EPIA-T700 uses two high-density, low profile connectors on the under side of the module that can also withstand vibrations of up to 5Gs making Mobile-ITX systems suitable for in-vehicle ...

The VIA EPIA-T700 uses two unique high density, low profile connectors on the under side of the module that can also withstand vibrations of up to 5Gs making Mobile-ITX systems suitable for in ...

In a demonstration, Holthaus showed the Mobile ITX system boot Windows XP and play a movie. The prototype system uses a 1GHz C7-M ULV (ultra low-voltage) processor and a CX700 chipset, but ...

The design isn’t based around the new mobile-ITX form factor, but VIA told us that the new form factor could potentially be used in a device like this, with the extra space being used to ...

VIA has introduced a new computer-on-a-module called the EPIA-T700. It’s the first module to use VIA’s new Mobile-ITX platform which measures just 6 centimeters by 6 centimeters. That’s just ...

Incredibly compact, 6cm x 6cm Mobile-ITX form factor is 50% smaller than Pico-ITX, enables next-generation embedded devices Taipei, Taiwan, 1 December 2009 - VIA Technologies, Inc, a leading ...

The VIA EPIA-T700 uses two unique high density, low profile connectors on the under side of the module that can also withstand vibrations of up to 5Gs making Mobile-ITX systems suitable for in ...

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AMD's current desktop motherboards are being offered with mobile processors ... Changwang's new AMD MoDT Mini-ITX motherboard is aimed at NAS and storage use, with support for 4 x 2.5GbE ethernet ...