Researchers in Iran developed a passive solar module cooling method using silicon carbide porous ceramic. When combined with ...

GIGABYTE Technology, a global leader in computing innovation, will return to COMPUTEX 2025 from May 20 to 23 under the theme "Omnipresence of Computing: AI ...

One of the key benefits of Intel's cooling tech here seems to be the ability to channel liquid where it's needed most: to hot ...

MEMS Labs, a pioneer of MEMS-based chips, announced that its innovative µCooling fan-on-a-chip tech will be expanded to AI data centers.

As demand grows for more powerful and efficient microelectronics systems, industry is turning to 3D integration—stacking ...

As electronic devices get smaller and more powerful, keeping them cool enough to work properly has become a major challenge. Now, researchers at the University of Tokyo have developed a new way to ...

Researchers from the University of Tokyo propose cooling chips using microchannels built into the chips themselves. The ...

Japanese scientists have made a major breakthrough in cooling electronic components. Their innovative system uses water in a ...

Japanese semiconductor manufacturer Rohm has unveiled a new compact HSDIP20 package using 4th generation SiC MOSFETs. The Sic modules were specifically ...

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Microchip addresses how AI is transforming data centres with advanced technologies for connectivity, storage and compute ...

TSMC is prepping a 9.5-reticle, 7,885 mm² multi-chiplet packages on 120×150 mm substrates with integrated power management ...