Design And Reuse

Dolphin Semiconductor and INTERA Group Announce Reference Platform Combining Analog Voice Sensing and Neuromorphic AI for Ultra-Low-Power Edge Intelligence

Dolphin Semiconductor, a leading provider of semiconductor IP solutions, and INTERA Group, a semiconductor innovation company specializing in neuromorphic ASIC architectures, today announced a ...
Design And Reuse

Embedded SoC Design Mistakes Startups Must Avoid

The race to build innovative semiconductor products is accelerating as startups enter markets such as Artificial Intelligence ...
Design And Reuse

China Develops Its First 3.5D "Infinity Chiplet" & 3D DRAM Tech As It Tackles External HBM Constraints Through Domestic AI Supply Chain

China's DFSX is working on fueling its domestic AI supply chain with next-gen 3.5D "Infinity Chiplet" architectures & 3D DRAM technologies. DFSX Is Working on China's First DF1000 AI Accelerator With ...
Design And Reuse

High-Speed Heterogeneous Integration with Multiphysics Analysis for TSMC SoW-X

TSMC's System-on-Wafer (TSMC-SoW™) technology and its highly advanced design necessitate a reliable and efficient ...
Design And Reuse

Axelera AI Publicly Releases Voyager Wingman, an AI Assistant That Speeds Application Development

Natural-language companion to the Voyager® Toolkit helps developers rapidly build high-accuracy ML pipelines, debug faster, quickly find answers, and optimize performance for Axelera-based systems ...
Design And Reuse

TYLsemi Raises $43 Million to Launch First Full-Stack Chiplet Platform for Custom AI Silicon

First production-ready chiplet portfolio spanning connectivity, power, and memory for XPUs; Reduces custom AI silicon development time and cost by up to 50% from architecture to h ...
Design And Reuse

Cabinet approves Rs 1.27 lakh crore Semicon 2.0 to strengthen India’s semiconductor ecosystem

The Union Cabinet, chaired by Prime Minister Narendra Modi, on Wednesday approved Semicon 2.0, a comprehensive programme with a budget outlay of ₹1,27,500 crore aimed at strengthening India’s ...
Design And Reuse

Intel Resolves 18A Yield Variability; A Storm to Engulf Samsung and TSMC?

The U.S.-based Intel, which had been subjected to harsh criticism for issuing ‘empty promises’ while struggling immensely to secure yield in micro-fabrication processes, has reportedly finally ...
Design And Reuse

Five Test Considerations to Prepare for Q-Day

Advances in quantum computing mean that legacy RSA and elliptic-curve algorithms need to be updated urgently. Q-Day, the date when non-quantum-safe cryptographic techniques and algorithms can be ...
Design And Reuse

SILITH and UMC Achieve Mass Production Milestone for Silicon Photonics

Accelerating High-Volume Silicon Photonics Manufacturing for AI Infrastructure. UMC delivers first mass-produced silicon photonics wafers from UMC’s Singapore 12-inch fab, marki ...
Design And Reuse

Quadric Extends Series C to $46M with Second Close led by World Bank's IFC

Quadric announced the second close of its Series C as it accelerates deployment of its programmable AI chip platform. Designed to run any AI model directly on the device, Quadric's technology supports ...
Design And Reuse

TrendForce Forecasts Up to 18% Server DRAM Price Increase in 3Q

Server DRAM contract prices are expected to climb as supply constraints and future shortages drive customer procurement. Server DRAM contract prices are expected to increase by 13% to 18% quarter over ...