SanDisk's High Bandwidth Flash Memory Could Equip GPUs With 4TB Of VRAM
SanDisk describes HBF as stacking up to 16 layers of BiCS 3D NAND with through-silicon vias (TSVs). A logic layer enables ...
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'Next generation of laptops': Intel unveils blueprints for a fully repairable and modular computer
Reference designs for a new kind of modular computer could be the gateway toward laptops and mini-PCs that are easily ...
SanDisk's new HBF memory combines 3D NAND capacity with HBM-like bandwidth
This hybrid creation stacks up a whopping 16 layers of SanDisk's latest 3D NAND dies using tiny data pipelines called through-silicon vias. There's also a special ...