Third-party chiplets are hitting the market as chiplet models evolve. Who's calling the shots isn't clear yet.

Technology Co-Optimization for Dense Edge Architectures using 3D Integration and Non-Volatile Memory” was published by ...

Where digital and analog designs are overlapping, and why it's becoming more difficult to ensure they work as expected over ...

The dream may be to have generative AI write RTL, but text is only one of the necessary things AI must understand to help ...

Any optimization problem must have a clear, unambiguous specification and a way to define the goodness of the solution. Today ...

LLMs and machine learning are automating expertise in an aging workforce.

Pooling CPU Memory for LLM Inference” was published by researchers at UC Berkeley. Abstract “The rapid growth of LLMs has ...

Despite its cost and complexity, HBM offers significant advantages when performance and bandwidth are critical.

The Synopsys Custom Design flow provides unique benefits for power electronics designers, and the close collaboration with ...

The team used a 3D printing technique called direct ink writing (DIW), an extrusion process in which a paste with controlled ...

Bandwidth Chiplet Interconnects for Advanced Packaging Technologies in AI/ML Applications: Challenges and Solutions” was ...

Taiwan, China, South Korea, and Japan continue to foster growth, while the rest of Asia competes for foreign investment and ...